Resetting Floor Life for Moisture-Sensitive Components
When moisture-sensitive devices exceed allowable floor life, they must be properly baked and dry packaged before they can safely return to production. ProEx provides JEDEC-compliant baking and dry packaging services to reset floor life and protect component integrity.
Our controlled process removes absorbed moisture and ensures devices are returned to a production-ready state.
jEDEC-Compliant Floor Life Reset
ProEx follows industry-recognized JEDEC standards to properly reset floor life for MSL-rated devices.
Controlled baking profiles based on MSL requirements
Proper handling of exceeded floor life components
Full moisture removal prior to packaging
Process control and traceability throughout the bake cycle
Dry Packaging & Moisture Protection
After baking, components are dry packaged to preserve the reset floor life and prevent re-exposure to moisture.
Moisture Barrier Bags (MBB)
Desiccant and Humidity Indicator Cards (HIC)
Vacuum sealing
ESD-safe handling and materials
Devices are returned sealed, protected, and ready for controlled storage or immediate production use.
Integrated Value-Added Services
For customers already using ProEx for programming, inspection, or Tape & Reel, baking and dry packaging can be seamlessly integrated into a single workflow.
Reduced handling and transfer risk
Faster turnaround times
One trusted partner for complete device readiness