Resetting Floor Life for Moisture-Sensitive Components

When moisture-sensitive devices exceed allowable floor life, they must be properly baked and dry packaged before they can safely return to production. ProEx provides JEDEC-compliant baking and dry packaging services to reset floor life and protect component integrity.

Our controlled process removes absorbed moisture and ensures devices are returned to a production-ready state.

Table showing floor life ratings at different levels with corresponding time durations and conditions: Level 1 - Unlimited, 30°C/85%RH; Level 2 - 1 Year, 30°C/60%RH; Level 2a - 4 Weeks, 30°C/60%RH; Level 3 - 168 Hours, 30°C/60%RH; Level 4 - 72 Hours, 30°C/60%RH; Level 5 - 48 Hours, 30°C/60%RH; Level 5a - 24 Hours, 30°C/60%RH; Level 6 - TOL, 30°C/60%RH.

Manufacturers rely on ProEx’s baking services for:

  • Prevention of moisture-related package failures such as delamination, cracking, and internal damage during high-temperature reflow soldering

  • Recovery of valuable semiconductor inventory that might otherwise be scrapped due to humidity exposure or uncontrolled storage conditions

  • Reconditioning of components when exposure history may be uncertain due to production delays, partially used reels, or component transfers between facilities

jEDEC-Compliant Floor Life Reset

ProEx follows industry-recognized JEDEC standards to properly reset floor life for MSL-rated devices.

  • Controlled baking profiles based on MSL requirements

  • Proper handling of exceeded floor life components

  • Full moisture removal prior to packaging

  • Process control and traceability throughout the bake cycle

  • Supports quality control requirements in regulated industries such as automotive, aerospace, medical, and industrial electronics

  • Helps protect component reliability before surface-mount assembly operations

Dry Packaging & Moisture Protection

After baking, components are dry packaged to preserve the reset floor life and prevent re-exposure to moisture.

  • Moisture Barrier Bags (MBB)

  • Desiccant and Humidity Indicator Cards (HIC)

  • Vacuum sealing

  • ESD-safe handling and materials

Devices are returned sealed, protected, and ready for controlled storage or immediate production use.

A medical instruction sheet about moisture-sensitive devices, including guidelines on shelf life, bag seal date, temperature limits, mounting conditions, humidity levels, and storage instructions.

Integrated Value-Added Services

For customers already using ProEx for programming, inspection, or Tape & Reel, baking and dry packaging can be seamlessly integrated into a single workflow.

  • Reduced handling and transfer risk

  • Faster turnaround times

  • One trusted partner for complete device readiness

The Operational advantages of combining baking with ProEx preparation services:

  • Handling steps between programming, inspection, and packaging processes are reduced

  • Transfer risk is minimized when devices must move between preparation processes

  • Supports streamlined manufacturing workflows for both OEM and EMS customers